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| Freescale Semiconductor Data Sheet: Product Preview Document Number: K60P104M100SF2 Rev. 1, 11/2010 Supports the following: MK60N256VLL100, MK60X256VLL100, MK60N512VLL100, MK60N256V L100, MK60X256V L100, MK60N512V L100 K60 Sub-Family Data Sheet K60P104M100SF2 * Performance - Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz * Memories and memory interfaces - Up to 512 KB program flash memory on nonFlexMemory devices - Up to 256 KB program flash memory on FlexMemory devices - Up to 256 KB FlexNVM on FlexMemory devices - 4 KB FlexRAM on FlexMemory devices - Up to 128 KB RAM - Serial programming interface (EzPort) - FlexBus external bus interface * Clocks - 1 to 32 MHz crystal oscillator - 32 kHz crystal oscillator - Multi-purpose clock generator * System peripherals - 10 low-power modes to provide power optimization based on application requirements - Memory protection unit with multi-master protection - 16-channel DMA controller, supporting up to 64 request sources - External watchdog monitor - Software watchdog - Low-leakage wakeup unit This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. (c) 2010-2010 Freescale Semiconductor, Inc. Preliminary Pr el im in ar y Features * Operating Characteristics - Voltage range: 1.71 to 3.6 V - Flash write voltage range: 1.71 to 3.6 V - Temperature range (ambient): -40 to 105C * Security and integrity modules - Hardware CRC module to support fast cyclic redundancy checks - Hardware random-number generator - Hardware encryption supporting DES, 3DES, AES, MD5, SHA-1, and SHA-256 algorithms - 128-bit unique identification (ID) number per chip * Human-machine interface - Low-power hardware touch sensor interface (TSI) - General-purpose input/output * Analog modules - 16-bit SAR ADC with PGA (x64) - 12-bit DAC - Analog comparator (CMP) containing a 6-bit DAC and programmable reference input - Voltage reference * Timers - Programmable delay block - Eight-channel motor control/general purpose/PWM timers - Two-channel quadrature decoder/general purpose timers - IEEE 1588 timers - Periodic interrupt timers - 16-bit low-power timer - Carrier modulator transmitter - Real-time clock * Communication interfaces - Ethernet controller with MII and RMII interface to external PHY and hardware IEEE 1588 capability - USB full-/low-speed On-the-Go controller with on-chip transceiver - Controller Area Network (CAN) module - SPI modules - I2C modules - UART modules - Secure Digital host controller (SDHC) - I2S 2 Pr el im in ar y K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................5 1.1 Determining valid orderable parts......................................5 2 Part identification......................................................................5 2.1 Description.........................................................................5 2.2 Format...............................................................................5 2.3 Fields.................................................................................5 2.4 Example............................................................................6 3 Terminology and guidelines......................................................6 3.1 Definition: Operating requirement......................................6 3.2 Definition: Operating behavior...........................................7 3.3 Definition: Attribute............................................................7 6 Peripheral operating requirements and behaviors....................20 6.1 Core modules....................................................................20 6.1.1 6.1.2 Debug trace timing specifications.........................20 JTAG electricals....................................................21 6.2 System modules................................................................24 6.3 Clock modules...................................................................24 6.3.1 6.3.2 MCG Specifications...............................................24 Oscillator Electrical Characteristics.......................26 6.3.2.1 6.3.2.2 Oscillator DC Electrical Specifications 26 Oscillator frequency specifications......27 3.4 Definition: Rating...............................................................8 3.5 Result of exceeding a rating..............................................8 3.6 Relationship between ratings and operating requirements......................................................................8 3.7 Guidelines for ratings and operating requirements............9 3.8 Definition: Typical value.....................................................9 3.9 Typical Value Conditions...................................................10 4 Ratings......................................................................................10 4.1 Thermal handling ratings...................................................10 4.2 Moisture handling ratings..................................................11 4.3 ESD handling ratings.........................................................11 4.4 Voltage and current operating ratings...............................11 5 General.....................................................................................12 5.1 Nonswitching electrical specifications...............................12 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 Voltage and Current Operating Requirements......12 LVD and POR operating requirements.................13 Voltage and current operating behaviors..............14 Power mode transition operating behaviors..........14 Power consumption operating behaviors..............15 5.1.5.1 Diagram: Typical IDD_RUN operating behavior...............................................17 5.1.6 5.1.7 5.1.8 EMC radiated emissions operating behaviors.......18 Designing with radiated emissions in mind...........19 Capacitance attributes..........................................19 5.2 Switching electrical specifications.....................................19 5.3 Thermal specifications.......................................................19 5.3.1 5.3.2 Thermal operating requirements...........................20 Thermal attributes.................................................20 6.6.2 6.6.3 Freescale Semiconductor, Inc. Pr el im in ar y 6.3.3 6.3.3.1 6.3.3.2 6.4.1 6.4.1.1 6.4.1.2 6.4.1.3 6.4.1.4 6.4.1.5 6.4.2 6.4.3 6.6.1 6.6.1.1 6.6.1.2 6.6.1.3 6.6.1.4 6.6.3.1 32kHz Oscillator Electrical Characteristics............28 32kHz Oscillator DC Electrical Specifications......................................28 32kHz Oscillator Frequency Specifications......................................28 6.4 Memories and memory interfaces.....................................29 Flash (FTFL) Electrical Characteristics.................29 Flash Timing Parameters -- Program and Erase............................................29 Flash Timing Parameters -- Commands..........................................29 Flash (FTFL) Current and Power Parameters..........................................31 Reliability Characteristics....................31 Write Endurance to FlexRAM for EEPROM.............................................32 EzPort Switching Specifications............................33 Flexbus Switching Specifications..........................34 6.5 Security and integrity modules..........................................36 6.6 Analog...............................................................................36 ADC electrical specifications.................................36 16-bit ADC operating conditions..........37 16-bit ADC electrical characteristics....39 16-bit ADC with PGA operating conditions............................................42 16-bit ADC with PGA characteristics...43 CMP and 6-bit DAC electrical specifications.........44 12-bit DAC electrical characteristics.....................45 12-bit DAC operating requirements.....45 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 3 6.6.3.2 6.6.4 12-bit DAC operating behaviors..........46 6.8.7 6.8.8 SDHC Specifications.............................................56 I2S Switching Specifications.................................57 Voltage Reference Electrical Specifications..........48 6.7 Timers................................................................................49 6.8 Communication interfaces.................................................49 6.8.1 6.8.2 6.8.3 6.8.4 6.8.5 Ethernet Switching Specifications.........................50 USB electrical specifications.................................51 USB DCD Electrical Specifications.......................51 USB Voltage Regulator Electrical Specifications. .52 DSPI Switching Specifications for Low-speed Operation..............................................................52 6.8.6 DSPI Switching Specifications (High-speed 6.9 Human-machine interfaces (HMI)......................................59 6.9.1 6.9.2 General Switching Specifications..........................59 TSI Electrical Specifications..................................59 7 Dimensions...............................................................................60 7.1 Obtaining package dimensions.........................................60 8 Pinout........................................................................................61 8.1 K60 Signal Multiplexing and Pin Assignments..................61 8.2 K60 Pinouts.......................................................................64 9 Revision History........................................................................65 mode)....................................................................54 4 Pr el im in ar y K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to www.freescale.com and perform a part number search for the following device numbers: PK60 and MK60. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## M FFF T PP CCC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Q K## M Qualification status Kinetis family Flash memory type Description Values * M = Fully qualified, general market flow * P = Prequalification * K60 * N = Program flash only * X = Program flash and FlexMemory Table continues on the next page... Freescale Semiconductor, Inc. Pr el im in ar y K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 5 Terminology and guidelines Field FFF Description Program flash memory size * * * * * * 32 = 32 KB 64 = 64 KB 128 = 128 KB 256 = 256 KB 512 = 512 KB 1M0 = 1 MB Values T PP Temperature range (C) Package identifier * V = -40 to 105 * * * * * * * * * * * * * * * * * * FM = 32 QFN (5 mm x 5 mm) FT = 48 QFN (7 mm x 7 mm) LF = 48 LQFP (7 mm x 7 mm) FX = 64 QFN (9 mm x 9 mm) LH = 64 LQFP (10 mm x 10 mm) LK = 80 LQFP (12 mm x 12 mm) MB = 81 MAPBGA (8 mm x 8 mm) LL = 100 LQFP (14 mm x 14 mm) ML = 104 MAPBGA (8 mm x 8 mm) LQ = 144 LQFP (20 mm x 20 mm) MD = 144 MAPBGA (13 mm x 13 mm) MF = 196 MAPBGA (15 mm x 15 mm) MJ = 256 MAPBGA (17 mm x 17 mm) 50 = 50 MHz 72 = 72 MHz 100 = 100 MHz 120 = 120 MHz 150 = 150 MHz CCC Maximum CPU frequency (MHz) N Packaging type 2.4 Example This is an example part number: MK60N512VMD100 3 Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. 6 Pr el im in ar y * R = Tape and reel * (Blank) = Trays K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.1.1 Example This is an example of an operating requirement, which you must meet for the accompanying operating behaviors to be guaranteed: Symbol VDD Description 1.0 V core supply volt age 0.9 Min. 1.1 Max. V Unit 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior, which is guaranteed if you meet the accompanying operating requirements: Symbol IWP Description Min. Max. Unit Digital I/O weak pullup/ 10 pulldown current 130 A 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 3.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digi -- tal pins Min. 7 Max. pF Unit Freescale Semiconductor, Inc. Pr el im in ar y K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 7 Terminology and guidelines 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: * Operating ratings apply during operation of the chip. * Handling ratings apply when the chip is not powered. This is an example of an operating rating: Symbol VDD Description 1.0 V core supply volt age -0.3 Pr el im in ar y Min. Max. 1.2 V The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. Operating rating 3.4.1 Example Unit 3.5 Result of exceeding a rating 40 Failures in time (ppm) 30 20 10 0 Measured characteristic K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 8 Preliminary Freescale Semiconductor, Inc. Terminology and guidelines 3.6 Relationship between ratings and operating requirements g tin h or an dlin g in rat g( mi n.) ing ui req in. (m nt me re ) ui req ax (m nt me re .) h or g dlin an ( ing rat x.) ma g g tin Op era Op t era era Op tin era Op Fatal range - Probable permanent failure Limited operating range - No permanent failure - Possible decreased life - Possible incorrect operation Normal operating range - No permanent failure - Correct operation Limited operating range - No permanent failure - Possible decreased life - Possible incorrect operation Fatal range - Probable permanent failure Handling range - Pr el im in ar y Description Min. 10 70 Typ. 130 Max. A - No permanent failure 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: * Never exceed any of the chip's ratings. * During normal operation, don't exceed any of the chip's operating requirements. * If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: * Lies within the range of values specified by the operating behavior * Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. 3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol IWP Unit Digital I/O weak pullup/pulldown current K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 9 Ratings 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 3500 IDD_STOP (A) 3000 2500 2000 1500 1000 500 0 0.90 TJ 3.9 Typical Value Conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol TA VDD Description Value Unit Ambient temperature 3.3 V supply voltage 25 3.3 C V 4 Ratings 10 Pr el im in ar y 105 C 25 C -40 C 0.95 1.00 1.05 1.10 VDD (V) 150 C K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Ratings 4.1 Thermal handling ratings Symbol TSTG TSDR Description Storage temperature Solder temperature, lead-free Solder temperature, leaded Min. -55 -- -- Max. 150 260 245 Unit C C Notes 1 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Pr el im in ar y Min. -- Max. 3 Unit -- Min. Max. Unit V V -2000 -500 -100 +2000 +500 +100 mA Min. -0.3 -- -0.3 -0.3 Max. 3.8 185 5.5 VDD + 0.3 Table continues on the next page... Notes 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol VHBM VCDM ILAT Description Notes 1 2 Electrostatic discharge voltage, human body model Electrostatic discharge voltage, charged-device model Latch-up current at ambient temperature of 85C 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Symbol VDD IDD VDIO VAIO Description Digital supply voltage Digital supply current Digital input voltage (except RESET, EXTAL, and XTAL) Analog, RESET, EXTAL, and XTAL input voltage Unit V mA V V K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 11 General Symbol ID VDDA IDDA VUSB_DP VUSB_DM VREGIN VBAT VRAM VRFVBAT Description Instantaneous maximum current single pin limit (applies to all port pins) Analog supply voltage Analog supply current1 USB_DP input voltage USB_DM input voltage USB regulator input RTC battery supply voltage VDD voltage required to retain RAM Min. -25 VDD - 0.3 TBD -0.3 -0.3 -0.3 -0.3 1.2 Max. 25 VDD + 0.3 TBD 3.63 3.63 6.0 3.8 -- -- Unit mA V mA V V V V V V VBAT voltage required to retain the VBAT register file 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 5 General 5.1 Nonswitching electrical specifications 5.1.1 Voltage and Current Operating Requirements Symbol VDD VDDA Description Min. Pr el im in ar y TBD Table 1. Voltage and current operating requirements Max. 3.6 3.6 0.1 0.1 1.71 1.71 -0.1 -0.1 Unit V V V V Notes Supply voltage Analog supply voltage VDD - VDDA VDD-to-VDDA differential voltage VSS - VSSA VSS-to-VSSA differential voltage VIH Input high voltage * 2.7 V VDD 3.6 V * 1.7 V VDD 2.7 V VIL Input low voltage * 2.7 V VDD 3.6 V * 1.7 V VDD 2.7 V VHYS Input hysteresis 0.7 x VDD 0.75 x VDD -- -- V V -- -- 0.06 x VDD Table continues on the next page... 0.35 x VDD 0.3 x VDD -- V V V K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 12 Preliminary Freescale Semiconductor, Inc. General Table 1. Voltage and current operating requirements (continued) Symbol IIC Description DC injection current -- single pin * VIN > VDD * VIN < VSS DC injection current -- total MCU limit, includes sum of all stressed pins * VIN > VDD * VIN < VSS 0 0 2 -0.2 mA mA 1 0 0 25 -5 mA mA Min. Max. Unit Notes 1 5.1.2 LVD and POR operating requirements Symbol VPOR VLVDH Description Min. Pr el im in ar y Table 2. LVD and POR operating requirements Typ. 1.1 TBD TBD Max. TBD TBD Unit V V 2.56 TBD TBD TBD TBD 2.70 2.80 2.90 3.00 60 TBD TBD TBD TBD TBD TBD TBD V V V V mV V TBD TBD TBD TBD 1.80 1.90 2.00 2.10 TBD TBD TBD TBD V V V V Table continues on the next page... 1. All functional non-supply pins are internally clamped to VSS and VDD. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two values. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if clock rate is very low (which would reduce overall power consumption). Notes Falling VDD POR detect voltage Falling low-voltage detect threshold -- high range (LVDV=01) Low-voltage warning thresholds -- high range VLVW1 VLVW2 VLVW3 VLVW4 VHYS VLVDL * Level 1 falling (LVWV=00) * Level 2 falling (LVWV=01) * Level 3 falling (LVWV=10) * Level 4 falling (LVWV=11) 1 Low-voltage inhibit reset/recover hysteresis -- high range Falling low-voltage detect threshold -- low range (LVDV=00) Low-voltage warning thresholds -- low range 1 VLVW1 VLVW2 VLVW3 VLVW4 * Level 1 falling (LVWV=00) * Level 2 falling (LVWV=01) * Level 3 falling (LVWV=10) * Level 4 falling (LVWV=11) K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 13 General Table 2. LVD and POR operating requirements (continued) Symbol VHYS VBG tLPO Description Low-voltage inhibit reset/recover hysteresis -- low range Bandgap voltage reference Internal low power oscillator period factory trimmed 1. Rising thresholds are falling threshold + VHYS TBD TBD Min. Typ. 40 1.00 1000 TBD TBD Max. Unit mV V s Notes 5.1.3 Voltage and current operating behaviors Symbol VOH Description Min. Pr el im in ar y Table 3. Voltage and current operating behaviors Max. Unit VDD - 0.5 VDD - 0.5 -- -- V V VDD - 0.5 VDD - 0.5 -- -- -- V V 100 mA -- -- 0.5 0.5 V V -- -- -- -- -- 30 0.5 0.5 V V 100 1 1 50 mA A A k Notes Output high voltage -- high drive strength * 2.7 V VDD 3.6 V, IOH = -10mA * 1.71 V VDD 2.7 V, IOH = -3mA Output high voltage -- low drive strength * 2.7 V VDD 3.6 V, IOH = -2mA * 1.71 V VDD 2.7 V, IOH = -0.6mA IOHT VOL Output high current total for all ports Output low voltage -- high drive strength * 2.7 V VDD 3.6 V, IOL = 10mA * 1.71 V VDD 2.7 V, IOL = 3mA Output low voltage -- low drive strength * 2.7 V VDD 3.6 V, IOL = 2mA * 1.71 V VDD 2.7 V, IOL = 0.6mA IOLT IIN IOZ RPU and RPD Output low current total for all ports Input leakage current (per pin) Hi-Z (off-state) leakage current (per pin) Internal weak pullup and pulldown resistors 1 1. Measured at VIL max and VDD min K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 14 Preliminary Freescale Semiconductor, Inc. General 5.1.4 Power mode transition operating behaviors In the table below, all specifications except tPOR, assume the following clock configuration: * CPU and system clocks = 100MHz * Bus and FlexBus clocks = 50 MHz * Flash clock = 25 MHz Table 4. Power mode transition operating behaviors tPOR After a POR event, amount of time from the point VDD reaches 1.8V to execution of the first instruction across the operating temperature range of the chip. RUN VLLS1 RUN * RUN VLLS1 * VLLS1 RUN Pr el im in ar y -- 300 s -- -- 4.1 s s 123.8 -- -- 4.1 s s 49.3 -- -- 4.1 s s 49.2 -- -- 4.1 5.9 s s -- -- 4.1 4.2 s s -- -- 4.1 5.8 s s Symbol Description Min. Max. Unit Notes 1 RUN VLLS2 RUN * RUN VLLS2 * VLLS2 RUN RUN VLLS3 RUN * RUN VLLS3 * VLLS3 RUN RUN LLS RUN * RUN LLS * LLS RUN RUN STOP RUN * RUN STOP * STOP RUN RUN VLPS RUN * RUN VLPS * VLPS RUN 1. Normal boot (FTFL_OPT[LPBOOT]=1) K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 15 General 5.1.5 Power consumption operating behaviors Table 5. Power consumption operating behaviors Symbol IDD_RUN Description Run mode current -- all peripheral clocks disa bled, code executing from flash * @ 1.8V * @ 3.0V IDD_RUN Run mode current -- all peripheral clocks ena bled, code executing from flash * @ 1.8V * @ 3.0V -- -- 40 42 TBD TBD mA mA 2 -- -- 55 56 TBD TBD mA mA Min. Typ. Max. Unit Notes 1 IDD_RUN_M Run mode current -- all peripheral clocks ena bled and peripherals active, code executing from AX flash * @ 1.8V * @ 3.0V IDD_WAIT IDD_STOP IDD_VLPR IDD_VLPR IDD_VLPW IDD_VLPS IDD_LLS IDD_VLLS3 Pr el im in ar y -- -- -- -- -- -- -- -- -- 85 85 TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA A A 15 1.4 1.25 TBD 1.05 30 12 -- -- -- -- -- 8 6 TBD TBD TBD TBD TBD A A 4 2 550 A A nA 3 Wait mode current at 3.0 V -- all peripheral clocks disabled Stop mode current at 3.0 V 4 Very-low-power run mode current at 3.0 V -- all peripheral clocks disabled Very-low-power run mode current at 3.0 V -- all peripheral clocks enabled Very-low-power wait mode current at 3.0 V 5 6 7 Very-low-power stop mode current at 3.0 V Low leakage stop mode current at 3.0 V Very low-leakage stop mode 3 current at 3.0 V * 128KB RAM devices * 64KB RAM devices IDD_VLLS2 IDD_VLLS1 IDD_VBAT Very low-leakage stop mode 2 current at 3.0 V Very low-leakage stop mode 1 current at 3.0 V Average current when CPU is not accessing RTC registers at 3.0 V 1. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock . MCG configured for FEI mode. All peripheral clocks disabled. 2. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, but peripherals are not in active operation. 3. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled, and peripherals are in active operation. 4. 25MHz core and system clock, 25MHz bus clock, and 12.5MHz FlexBus and flash clock. MCG configured for FEI mode. 5. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. Code executing from flash. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 16 Preliminary Freescale Semiconductor, Inc. General 6. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 7. 2 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for fast IRCLK mode. All peripheral clocks disabled. 5.1.5.1 * * * * * Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) All peripheral clocks disabled except FTFL LVD disabled, USB regulator disabled No GPIOs toggled Code execution from flash Figure 1. Run mode supply current vs. core frequency -- all peripheral clocks disabled The following data was measured under these conditions: * MCG in FEI mode (39.0625 kHz IRC), except for 1 MHz core (FBE) * All peripheral clocks enabled but peripherals are not in active operation * LVD disabled, USB regulator disabled K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Pr el im in ar y Preliminary 17 General * No GPIOs toggled * Code execution from flash Figure 2. Run mode supply current vs. core frequency -- all peripheral clocks enabled 5.1.6 EMC radiated emissions operating behaviors Symbol VRE1 VRE2 VRE3 VRE4 Description Radiated emissions voltage, band 1 Radiated emissions voltage, band 2 Radiated emissions voltage, band 3 Radiated emissions voltage, band 4 Frequency band (MHz) 0.15-50 50-150 150-500 500-1000 0.15-1000 Pr el im in ar y Table 6. EMC radiated emissions operating behaviors Typ. TBD TBD TBD TBD TBD -- Unit dBV Notes 1, 2 VRE_IEC_SAE IEC and SAE level 2, 3 1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits--TEM/ Wideband TEM (GTEM) Cell Method. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 18 Preliminary Freescale Semiconductor, Inc. General 2. VDD = 3 V, TA = 25 C, fOSC = 16 MHz (crystal), fBUS = 20 MHz 3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits--TEM/Wideband TEM (GTEM) Cell Method. 5.1.7 Designing with radiated emissions in mind 1. To find application notes that provide guidance on designing your system to minimize interference from radiated emissions, go to www.freescale.com and perform a keyword search for "EMC design." 5.1.8 Capacitance attributes Symbol CIN_A CIN_D Description Pr el im in ar y Table 7. Capacitance attributes Min. -- -- Max. 7 7 Unit pF pF Input capacitance: analog pins Input capacitance: digital pins 5.2 Switching electrical specifications Symbol Description Table 8. Device clock specifications Min. Normal run mode Max. Unit Notes fSYS fBUS FB_CLK fFLASH System and core clock Bus clock -- -- -- -- 100 50 50 25 MHz MHz MHz MHz FlexBus clock Flash clock VLPR mode fSYS fBUS FB_CLK fFLASH System and core clock Bus clock FlexBus clock Flash clock -- -- -- -- 2 2 2 1 MHz MHz MHz MHz 5.3 Thermal specifications K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 19 Peripheral operating requirements and behaviors 5.3.1 Thermal operating requirements Table 9. Thermal operating requirements Symbol TJ TA Description Die junction temperature Ambient temperature Min. -40 -40 Max. 125 105 Unit C C Board type Singlelayer (1s) Four-layer (2s2p) Singlelayer (1s) Four-layer (2s2p) -- -- -- Symbol RJA RJA RJMA RJMA RJB RJC JT Pr el im in ar y Description 104 MAPBGA 100 LQFP Unit Thermal resistance, junction to ambient (natural convection) TBD TBD C/W Thermal resistance, junction to ambient (natural convection) TBD TBD C/W Thermal resistance, junction to ambient (200 ft./ min. air speed) TBD TBD TBD TBD C/W C/W Thermal resistance, junction to ambient (200 ft./ min. air speed) Thermal resistance, junction to board Thermal resistance, junction to case TBD TBD C/W TBD TBD C/W Thermal characterization parameter, junction to package top outside center (natural convection) TBD TBD C/W 5.3.2 Thermal attributes Notes 1 1 1 1 2 3 4 6 Peripheral operating requirements and behaviors 6.1 Core modules Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions--Forced Convection (Moving Air). 2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions --Junction-to-Board. 3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate temperature used for the case temperature. The value includes the thermal resistance of the interface material between the top of the package and the cold plate. 4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air). 1. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 20 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.1.1 Debug trace timing specifications Table 10. Debug trace operating behaviors Symbol Tcyc Twl Twh Tr Tf Ts Th Description Clock period Low pulse width High pulse width Clock and data rise time Clock and data fall time Data setup Data hold Min. Max. Unit MHz ns ns ns ns ns ns Frequency dependent 2 2 -- -- 3 2 -- -- 3 3 -- -- TRACE_CLKOUT TRACE_D[3:0] 6.1.2 JTAG electricals Symbol Description Operating voltage J1 Pr el im in ar y Figure 3. TRACE_CLKOUT specifications Ts Th Ts Th Figure 4. Trace data specifications Table 11. JTAG electricals Min. 2.7 Max. 3.6 Unit V MHz 0 0 1/J1 Table continues on the next page... 25 50 -- ns TCLK frequency of operation * JTAG and CJTAG * Serial Wire Debug J2 TCLK cycle period K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 21 Peripheral operating requirements and behaviors Table 11. JTAG electricals (continued) Symbol J3 Description TCLK clock pulse width * JTAG and CJTAG * Serial Wire Debug J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 J14 TCLK rise and fall times Boundary scan input data setup time to TCLK rise Boundary scan input data hold time after TCLK rise TCLK low to boundary scan output data valid TCLK low to boundary scan output high-Z 20 10 -- 20 0 -- -- -- -- 3 -- -- 30 30 -- -- 4 4 ns ns ns ns ns ns ns ns ns ns ns Min. Max. Unit ns TMS, TDI input data setup time to TCLK rise TMS, TDI input data hold time after TCLK rise TCLK low to TDO data valid TCLK low to TDO high-Z TRST assert time TRST setup time (negation) to TCLK high TCLK (input) 22 Pr el im in ar y 16 1 -- -- 100 8 -- -- J2 J3 J3 J4 J4 Figure 5. Test clock input timing K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors TCLK J5 J6 Data inputs J7 Input data valid Data outputs J8 Output data valid Data outputs Data outputs TCLK TDI/TMS TDO TDO J11 TDO Freescale Semiconductor, Inc. Pr el im in ar y J7 Output data valid Figure 6. Boundary scan (JTAG) timing J9 J10 Input data valid J11 Output data valid J12 Output data valid Figure 7. Test Access Port timing K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 23 Peripheral operating requirements and behaviors TCLK J14 J13 TRST Figure 8. TRST timing There are no specifications necessary for the device's system modules. 6.3 Clock modules 6.3.1 MCG Specifications Symbol fints_ft fints_t tirefsts fdco_res_t Description Pr el im in ar y Table 12. MCG specifications Min. -- Typ. Max. -- 32.768 -- kHz kHz s 31.25 -- -- 39.0625 4 TBD 0.1 0.3 -- 0.2 0.5 -- + 0.5 - 1.0 -- 0.5 TBD 3.5 3.875 3 4 -- 4.125 5 Table continues on the next page... 6.2 System modules Unit Notes Internal reference frequency (slow clock) -- facto ry trimmed at nominal VDD and 25C Internal reference frequency (slow clock) -- user trimmed Internal reference (slow clock) startup time Resolution of trimmed DCO output frequency at fixed voltage and temperature -- using SCTRIM and SCFTRIM %fdco fdco_res_t Resolution of trimmed DCO output frequency at fixed voltage and temperature -- using SCTRIM only fdco_t fdco_t %fdco Total deviation of trimmed DCO output frequency over voltage and temperature Total deviation of trimmed DCO output frequency over fixed voltage and temperature range of 0- 70C Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25C Internal reference frequency (fast clock) -- user trimmed %fdco %fdco fintf_ft fintf_t MHz MHz K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 24 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 12. MCG specifications (continued) Symbol tirefstf floc_low floc_high Description Internal reference startup time (fast clock) Loss of external clock minimum frequency -- RANGE = 00 Loss of external clock minimum frequency -- RANGE = 01, 10, or 11 FLL fdco_t DCO output fre quency range -- user trimmed and DMX32=0 Low range (DRS=00) 640 x fints_t Mid range (DRS=01) 1280 x fints_t 40 41.94 50 MHz 20 20.97 25 MHz 1, 2 Min. -- (3/5) x fints_t (16/5) x fints_t Typ. TBD -- -- Max. TBD -- -- Unit s kHz kHz Notes fdco_t_DMX3 DCO output fre quency range -- 2 reference = 32,768Hz and DMX32=1 Pr el im in ar y Mid-high range (DRS=10 192)0 x fints_t 60 62.91 75 High range (DRS=11) 2560 x fints_t 80 83.89 100 Low range (DRS=00) 732 x fints_t -- 23.99 -- Mid range (DRS=01) 1464 x fints_t -- 47.97 -- Mid-high range (DRS=10) 2197 x fints_t -- 71.99 -- High range (DRS=11) 2929 x fints_t -- 95.98 -- -- -- -- TBD TBD -- TBD TBD 1 ps ps ms PLL 48.0 2.0 -- -- 1.49 4.47 -- -- -- 400 TBD -- -- -- 100 4.0 -- -- 2.98 5.97 0.15 + 1075(1/ fpll_ref) ps ps % % ms MHz MHz MHz 3 MHz MHz MHz Jcyc_fll Jacc_fll tfll_acquire FLL period jitter 4 FLL accumulated jitter of DCO output over a 1s time window FLL target frequency acquisition time 5 fvco fpll_ref Jcyc_pll Jacc_pll Dlock Dunl tpll_lock VCO operating frequency PLL reference frequency range PLL period jitter PLL accumulated jitter over 1s window Lock entry frequency tolerance Lock exit frequency tolerance Lock detector detection time MHz MHz 6, 7 6,7 8 1. The resulting system clock frequencies should not exceed their maximum specified values. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 25 Peripheral operating requirements and behaviors 2. 3. 4. 5. This specification includes the 2% precision of the internal reference frequency (slow clock). The resulting clock frequency must not exceed the maximum specified clock frequency of the device. This specification was obtained at TBD frequency. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 6. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 7. This specification was obtained at internal frequency of TBD. 8. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 6.3.2 Oscillator Electrical Characteristics This section provides the electrical characteristics of the module. 6.3.2.1 Symbol VDD33OSC IDDOSC Oscillator DC Electrical Specifications Description Min. Table 13. Oscillator DC electrical specifications, (VSSOSC= 0 VDC) (TA = TL to TH) Typ. -- Max. 3.6 Unit V Notes 3.3 V supply voltage 1.71 Supply current -- low-power mode * 32 kHz * 1 MHz * 4 MHz * 8 MHz Pr el im in ar y -- -- -- -- -- -- -- 500 100 200 300 700 1.2 1.5 -- -- -- -- -- -- -- nA A A A A mA mA -- -- -- -- -- -- -- -- -- Table continues on the next page... 25 -- -- -- -- -- -- -- -- -- A A A A mA mA mA 200 400 800 1.5 3 4 -- -- 1 * 16 MHz * 24 MHz * 32 MHz IDDOSC Supply current -- high gain mode * 32 kHz * 1 MHz * 4 MHz * 8 MHz * 16 MHz * 24 MHz * 32 MHz 1 Cx Cy EXTAL load capacitance XTAL load capacitance 2, 3 2,3 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 26 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 13. Oscillator DC electrical specifications, (VSSOSC= 0 VDC) (TA = TL to TH) (continued) Symbol RF Description Feedback resistor -- low-frequency, low-power mode Feedback resistor -- low-frequency, high-gain mode Feedback resistor -- high-frequency, low-power mode (1 - 8 MHz, 8 - 32 MHz) Feedback resistor -- high-frequency, high-gain mode (1 - 8 MHz, 8 - 32 MHz) RS Series resistor -- low-frequency, low-power mode Min. -- -- -- -- -- -- -- Typ. -- 10 -- 1 -- Max. -- -- -- -- -- -- -- Unit M M M M k k k Notes 2,3 Series resistor -- low-frequency, high-gain mode Series resistor -- high-frequency, low-power mode Series resistor -- high-frequency, high-gain mode * 1 MHz resonator * 2 MHz resonator * 4 MHz resonator * 8 MHz resonator * 16 MHz resonator * 20 MHz resonator * 32 MHz resonator Vpp Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, low-power mode Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, high-gain mode Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, low-power mode Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, high-gain mode 1. VDD33OSC=3.3 V, Temperature =27 C, Cx/Cy=20 pF 2. See crystal or resonator manufacturer's recommendation 3. RF and Cx,Cy are integrated in low-frequency, low-power mode and must not be attached externally Freescale Semiconductor, Inc. Pr el im in ar y 200 -- -- -- -- -- -- -- -- -- 6.6 3.3 0 0 0 0 0 -- -- -- -- -- -- -- -- -- -- -- k k k k k k k V V V V 0.6 0.75 x VDD33OSC -- VDD33OSC 0.6 0.75 x VDD33OSC VDD33OSC K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 27 Peripheral operating requirements and behaviors 6.3.2.2 Oscillator frequency specifications Table 14. Oscillator frequency specifications, (VDD33OSC = VDD33OSC (min) to VDD33OSC (max), TA = TL to TH) Symbol fosc_lo fosc_hi_1 fosc_hi_2 tdc_extal tcst Description Oscillator crystal or resonator frequency -- low frequency mode Oscillator crystal or resonator frequency -- high frequency mode (low range) Oscillator crystal or resonator frequency -- high frequency mode (high range) Input clock duty cycle (external clock mode) Min. 32 1 8 40 -- -- -- -- Typ. -- -- -- 50 Max. 40 8 32 60 -- -- -- -- Unit kHz MHz MHz % Notes Crystal start-up time -- 32 kHz low-frequency, low-power mode Crystal start-up time -- 32 kHz low-frequency, high-gain mode Pr el im in ar y TBD 800 4 3 ms ms ms ms Min. 1.71 -- -- -- -- Typ. -- 100 2.5 15 0.6 Max. 3.6 -- -- -- -- 1, 2, 3 Crystal start-up time -- 8 MHz high-frequency, low-power mode Crystal start-up time -- 8 MHz high-frequency, high-gain mode 1. This parameter is characterized before qualification rather than 100% tested. 2. Proper PC board layout procedures must be followed to achieve specifications. 3. Crystal start up time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 6.3.3 32kHz Oscillator Electrical Characteristics This section describes the module electrical characteristics. 6.3.3.1 32kHz Oscillator DC Electrical Specifications Table 15. 32kHz Oscillator Module DC Electrical Specifications (VSSOSC= 0 VDC) (TA = TL to TH) Symbol VBAT RF Cpara Cload Vpp Description Supply voltage Internal feedback resistor Parasitical capacitance of EXTAL32 and XTAL32 Internal load capacitance (programmable) Peak-to-peak amplitude of oscillation Unit V M pF pF V K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 28 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.3.3.2 32kHz Oscillator Frequency Specifications Table 16. 32kHz oscillator frequency specifications (VDD33OSC = VDD33OSC (min) to VDD33OSC (max), TA = TL to TH) Symbol fosc_lo tstart Description Oscillator crystal Crystal start-up time Min. -- -- Typ. 32 1000 Max. -- -- Unit kHz ms 1, 2 Notes 1. This parameter is characterized before qualification rather than 100% tested. 2. Proper PC board layout procedures must be followed to achieve specifications. 6.4 Memories and memory interfaces 6.4.1 Flash (FTFL) Electrical Characteristics This section describes the electrical characteristics of the FTFL module. 6.4.1.1 Flash Timing Parameters -- Program and Erase The following characteristics represent the amount of time the internal charge pumps are active and do not include command overhead. Table 17. NVM program/erase timing characteristics Min. -- -- -- Typ. 20 20 Max. TBD 100 800 Symbol thvpgm4 thversscr thversblk Description Pr el im in ar y Unit s ms ms 160 Notes Longword Program high-voltage time Sector Erase high-voltage time Erase Block high-voltage time 1 1 1. Maximum time based on expectations at cycling end-of-life. 6.4.1.2 Symbol trd1blk trd1sec2k tpgmchk Flash Timing Parameters -- Commands Table 18. Flash command timing characteristics Description Read 1s Block execution time Read 1s Section execution time (2 KB flash sec tor) Program Check execution time Min. -- -- -- Table continues on the next page... Typ. -- -- -- Max. 1.4 40 35 Unit ms s s Notes K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 29 Peripheral operating requirements and behaviors Table 18. Flash command timing characteristics (continued) Symbol trdrsrc tpgm4 tersblk tersscr tpgmsec2k trd1all trdonce tpgmonce tersall tvfykey tpgmpart tsetram32k tsetram256k Description Read Resource execution time Program Longword execution time Erase Flash Block execution time Erase Flash Sector execution time Program Section execution time (2 KB flash sec tor) Read 1s All Blocks execution time Read Once execution time Min. -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. -- 50 160 20 TBD -- -- Max. 35 TBD 800 100 TBD 2.8 35 Unit s s ms ms ms ms s s 1 2 2 Notes 1 Program Once execution time Erase All Blocks execution time Pr el im in ar y 50 TBD 320 -- 1600 35 ms s 175 TBD TBD TBD ms ms ms TBD TBD Byte-write to FlexRAM for EEPROM operation -- -- -- -- -- 100 TBD TBD 1.5 s TBD TBD TBD TBD ms ms ms ms TBD 2.5 Word-write to FlexRAM for EEPROM operation -- -- -- -- -- 100 TBD TBD TBD TBD TBD TBD 1.5 TBD 2.5 s ms ms ms ms Longword-write to FlexRAM for EEPROM operation Table continues on the next page... 2 1 Verify Backdoor Access Key execution time Program Partition for EEPROM execution time Set FlexRAM Function execution time for 32 KB of EEPROM backup Set FlexRAM Function execution time for 256 KB of EEPROM backup teewr8bers teewr8b32k teewr8b64k Byte-write to erased FlexRAM location execution time Byte-write to FlexRAM execution time (32 KB EEPROM backup) Byte-write to FlexRAM execution time (64 KB EEPROM backup) 3 teewr8b128k Byte-write to FlexRAM execution time (128 KB EEPROM backup) teewr8b256k Byte-write to FlexRAM execution time (256 KB EEPROM backup) teewr16bers Word-write to erased FlexRAM location execu tion time teewr16b32k Word-write to FlexRAM execution time (32 KB EEPROM backup) teewr16b64k Word-write to FlexRAM execution time (64 KB EEPROM backup) teewr16b128k Word-write to FlexRAM execution time (128 KB EEPROM backup) teewr16b256k Word-write to FlexRAM execution time (256 KB EEPROM backup) K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 30 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 18. Flash command timing characteristics (continued) Symbol teewr32bers Description Longword-write to erased FlexRAM location exe cution time Min. -- -- -- -- -- Typ. 200 TBD TBD TBD TBD Max. TBD TBD 2.7 TBD 3.7 Unit s ms ms ms ms Notes teewr16b32k Longword-write to FlexRAM execution time (32 KB EEPROM backup) teewr16b64k Longword-write to FlexRAM execution time (64 KB EEPROM backup) teewr32b128k Longword-write to FlexRAM execution time (128 KB EEPROM backup) teewr32b256k Longword-write to FlexRAM execution time (256 KB EEPROM backup) 1. Assumes 25MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased. 6.4.1.3 Flash (FTFL) Current and Power Parameters Description Symbol IDD_PGM Pr el im in ar y Table 19. Flash (FTFL) current and power parameters Typ. 10 Unit mA Worst case programming current in program flash 6.4.1.4 Symbol Reliability Characteristics Description Table 20. NVM reliability characteristics Min. Typ.1 Program Flash 5 Max. Unit Notes tnvmretp10k tnvmretp1k tnvmretp100 nnvmcycp Data retention after up to 10 K cycles Data retention after up to 1 K cycles TBD TBD TBD TBD -- -- -- -- years years years 2 2 2 3 10 15 Data retention after up to 100 cycles Cycling endurance 10 K Data Flash cycles tnvmretd10k tnvmretd1k tnvmretd100 nnvmcycd Data retention after up to 10 K cycles Data retention after up to 1 K cycles Data retention after up to 100 cycles Cycling endurance 5 10 15 10 K FlexRAM as EEPROM TBD TBD TBD TBD -- -- -- -- years years years cycles 2 2 2 3 tnvmretee100 Data retention up to 100% of write endurance 5 TBD -- years 2 Table continues on the next page... K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 31 Peripheral operating requirements and behaviors Table 20. NVM reliability characteristics (continued) Symbol tnvmretee10 tnvmretee1 Description Data retention up to 10% of write endurance Data retention up to 1% of write endurance Min. 10 15 35 K 315 K 1.27 M 10 M 80 M Typ.1 TBD TBD TBD TBD TBD TBD TBD Max. -- -- -- -- -- -- -- Unit years years writes writes writes writes writes Notes 2 2 4 4 4 4 4 nnvmwree16 Write endurance with an EEPROM backup to FlexRAM ratio of 16 nnvmwree128 Write endurance with an EEPROM backup to FlexRAM ratio of 128 nnvmwree512 Write endurance with an EEPROM backup to FlexRAM ratio of 512 nnvmwree4k Write endurance with an EEPROM backup to FlexRAM ratio of 4096 nnvmwree32k Write endurance with an EEPROM backup to FlexRAM ratio of 32,768 1. Typical data retention values are based on intrinsic capability of the technology measured at high temperature derated to 25C. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618. 2. Data retention is based on Tjavg = 55C (temperature profile over the lifetime of the application). 3. Cycling endurance represents number of program/erase cycles at -40C Tj 125C 4. Write endurance represents the number of writes to FlexRAM at -40C Tj 125C influenced by the cycling endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum value assumes all byte-writes to FlexRAM. 6.4.1.5 Write Endurance to FlexRAM for EEPROM When the FlexNVM partition code is not set to full data flash, the EEPROM data set size can be set to any of several non-zero values. The bytes not assigned to data flash via the FlexNVM partition code are used by the FTFL to obtain an effective endurance increase for the EEPROM data. The built-in EEPROM record management system raises the number of program/erase cycles that can be attained prior to device wear-out by cycling the EEPROM data through a larger EEPROM NVM storage space. While different partitions of the FlexNVM are available, the intention is that a single choice for the FlexNVM partition code and EEPROM data set size are used throughout the entire lifetime of a given application. The EEPROM endurance equation and graph shown below assume that only one configuration is ever used. Writes_subsystem = EEPROM - 2 x EEESPLIT x EEESIZE EEESPLIT x EEESIZE x Write_efficiency x nnvmcycd where * Writes_subsystem -- minimum writes to FlexRAM for subsystem (each subsystem can have different endurance) K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 32 Pr el im in ar y Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors * EEPROM -- allocated FlexNVM for each EEPROM subsystem based on DEPART; entered with Program Partition command * EEESPLIT -- FlexRAM split factor for subsystem; entered with the Program Partition command * EEESIZE -- total allocated FlexRAM based on DEPART; entered with Program Partition command * Write_efficiency -- * 0.25 for 8-bit writes to FlexRAM * 0.50 for 16-bit or 32-bit writes to FlexRAM 6.4.2 EzPort Switching Specifications Table 21. EzPort switching specifications Num Description Operating voltage Table continues on the next page... Min. 2.7 Max. 3.6 Unit V Freescale Semiconductor, Inc. Pr el im in ar y Figure 9. EEPROM backup writes to FlexRAM K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 33 * nnvmcycd -- data flash cycling endurance Peripheral operating requirements and behaviors Table 21. EzPort switching specifications (continued) Num EP1 EP1a EP2 EP3 EP4 EP5 EP6 EP7 EP8 EP9 Description EZP_CK frequency of operation (all commands except READ) EZP_CK frequency of operation (READ command) EZP_CS negation to next EZP_CS assertion EZP_CS input valid to EZP_CK high (setup) EZP_CK high to EZP_CS input invalid (hold) EZP_D input valid to EZP_CK high (setup) EZP_CK high to EZP_D input invalid (hold) Min. -- -- 2 x tEZP_CK 5 5 2 5 Max. fSYS/2 fSYS/8 -- -- -- -- -- Unit MHz MHz ns ns ns ns ns ns ns ns EZP_CK low to EZP_Q output valid (setup) EZP_CK low to EZP_Q output invalid (hold) EZP_CS negation to EZP_Q tri-state EZP_CK EZP_CS EZP_Q (output) EZP_D (input) 6.4.3 Flexbus Switching Specifications All processor bus timings are synchronous; input setup/hold and output delay are given in respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be the same as the internal system bus frequency or an integer divider of that frequency. 34 Pr el im in ar y -- 0 12 -- -- 12 EP3 EP4 EP2 EP9 EP7 EP8 EP5 EP6 Figure 10. EzPort Timing Diagram K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors The following timing numbers indicate when data is latched or driven onto the external bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be derived from these values. Table 22. Flexbus switching specifications Num Description Operating voltage Frequency of operation FB1 FB2 FB3 FB4 FB5 Clock period Address, data, and control output valid Address, data, and control output hold Data and FB_TA input setup Data and FB_TA input hold Min. 2.7 -- 20 TBD 0 Max. 3.6 50 -- 11.5 -- -- -- Unit V Mhz ns ns ns ns ns 1 1 2 2 Notes 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], and FB_TS. 2. Specification is valid for all FB_AD[31:0] and FB_TA. FB1 FB_CLK FB_A[Y] FB_D[X] FB_RW FB_TS FB_CSn FB_OEn FB_BE/BWEn FB4 AA=1 FB_TA FB_TSIZ[1:0] Freescale Semiconductor, Inc. Pr el im in ar y 8.5 0.5 FB5 FB3 Address FB4 FB2 Address Data AA=1 AA=0 FB5 AA=0 TSIZ Figure 11. FlexBus read timing diagram K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 35 Peripheral operating requirements and behaviors FB1 FB_CLK FB3 FB_A[Y] FB2 Address FB_D[X] Address Data FB_RW FB_TS FB_CSn FB_OEn FB_BE/BWEn FB_TA FB_TSIZ[1:0] 6.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.6 Analog 6.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 23 and Table 24 are achievable on the differential pins (ADCx_DP0, ADCx_DM0, ADC, ADCx_DP1, ADCx_DM1, ADCx_DP3, and ADCx_DP3). The ADCx_DP2 and ADCx_DM2 ADC inputs are used K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 36 Pr el im in ar y AA=1 AA=0 FB4 FB5 AA=1 AA=0 TSIZ Figure 12. FlexBus write timing diagram Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors as the PGA inputs and are not direct device pins. Accuracy specifications for these pins are defined in Table 25 and Table 26. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 6.6.1.1 Symbol VDDA VDDA VSSA VREFH VREFL VADIN CADIN 16-bit ADC operating conditions Table 23. 16-bit ADC operating conditions Description Supply voltage Supply voltage Conditions Absolute Delta to VDD (VDDVDDA) Delta to VSS (VSSVSSA) Min. 1.71 -100 -100 1.13 Typ.1 -- 0 0 Max. 3.6 +100 +100 VDDA VSSA Unit V mV mV V V V 2 2 Notes Ground voltage ADC reference voltage high Reference volt age low Input voltage Input capaci tance RADIN Input resistance Freescale Semiconductor, Inc. Pr el im in ar y VDDA VSSA -- 8 4 VSSA VREFL -- -- VREFH 10 5 * 16 bit modes * 8/10/12 bit modes pF -- 2 5 k Table continues on the next page... K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 37 Peripheral operating requirements and behaviors Table 23. 16-bit ADC operating conditions (continued) Symbol RAS Description Analog source resistance Conditions 16 bit modes * fADCK > 8MHz * fADCK = 4-8MHz * fADCK < 4MHz 13/12 bit modes * fADCK > 16MHz * fADCK > 8MHz -- -- -- -- -- -- -- -- 0.5 1 2 5 k k k k -- -- -- -- -- -- 0.5 1 2 k k k Min. Typ.1 Max. Unit Notes External to MCU Assumes ADLSMP=0 fADCK ADC conversion clock frequency 1. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. DC potential difference. 38 Pr el im in ar y * fADCK = 4-8MHz * fADCK < 4MHz 11/10 bit modes * fADCK > 8MHz -- -- -- -- -- -- -- -- -- -- 2 5 k k k k k * fADCK = 4-8MHz * fADCK < 4MHz 10 5 9/8 bit modes * fADCK > 8MHz * fADCK < 8MHz 10 ADLPC=0, ADHSC=1 * 16 bit modes * 13 bit modes 1.0 1.0 -- -- TBD TBD MHz MHz ADLPC=0, ADHSC=0 * 16 bit modes * 13 bit modes 1.0 1.0 1.0 1.0 -- -- -- -- 8.0 MHz MHz MHz MHz 12.0 5.0 8.0 ADLPC=1, ADHSC=1 * 16 bit modes * 13 bit modes ADLPC=1, ADHSC=0 * 16 bit modes * 13 bit modes 1.0 1.0 -- -- 2.5 5.0 MHz MHz K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Z AS R AS V ADIN V AS C AS Pad leakage due to input protection R ADIN ADC SAR ENGINE 6.6.1.2 Symbol IDDA 16-bit ADC electrical characteristics Description Conditions1 Min. -- -- -- -- -- Table 24. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Typ.2 215 340 470 610 Max. -- -- -- -- Supply current * ADLPC=1, ADHSC=0 * ADLPC=1, ADHSC=1 * ADLPC=0, ADHSC=0 * ADLPC=0, ADHSC=1 Pr el im in ar y INPUT PIN R ADIN INPUT PIN R ADIN INPUT PIN C ADIN R ADIN Figure 13. ADC input impedance equivalency diagram Unit A A A A A Notes ADLSMP= 0 ADCO=1 Supply current * Stop, reset, module off * ADLPC=1, ADHSC=0 * ADLPC=1, ADHSC=1 * ADLPC=0, ADHSC=0 * ADLPC=0, ADHSC=1 0.01 2.4 4.0 5.2 6.2 0.8 fADACK ADC asynchro nous clock source TBD TBD TBD TBD TBD TBD TBD TBD MHz MHz MHz MHz tADACK = 1/ fADACK Sample Time See Reference Manual chapter for sample times Conversion Time See Reference Manual chapter for conversion times Table continues on the next page... K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 39 Peripheral operating requirements and behaviors Table 24. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol TUE Description Total unadjusted error Conditions1 * 16 bit differential * 16 bit single-ended * 13 bit differential * 12 bit single-ended * 11 bit differential * 10 bit single-ended * 9 bit differential * 8 bit single-ended * 16 bit differential * 13 bit differential * 11 bit differential * 9 bit differential Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ.2 14.0 13.0 1.5 TBD 0.8 TBD 0.5 0.5 2.5 2.5 0.7 0.7 0.5 0.2 0.2 Max. TBD TBD TBD TBD TBD TBD 1.0 1.0 Unit LSB3 Notes Max hard ware aver aging (AVGE = %1, AVGS = %11) DNL Differential nonlinearity Pr el im in ar y TBD TBD TBD TBD TBD TBD 0.5 0.5 -- -- * 16 bit single-ended * 12 bit single-ended * 10 bit single-ended * 8 bit single-ended * 16 bit differential * 13 bit differential * 11 bit differential * 9 bit differential TBD -6 to +2.5 -2 to +12 1.0 1.0 0.5 0.5 0.3 0.3 4.0 4.0 0.7 0.7 0.4 0.4 0.2 0.2 * 16 bit single-ended * 12 bit single-ended * 10 bit single-ended * 8 bit single-ended * 16 bit differential * 13 bit differential * 12 bit single-ended * 11 bit differential * 10 bit single-ended * 9 bit differential * 8 bit single-ended TBD TBD TBD TBD 0.5 0.5 -- -- * 16 bit single-ended TBD TBD TBD TBD 0.5 0.5 Table continues on the next page... LSB3 Max hard ware aver aging (AVGE = %1, AVGS = %11) INL Integral non-line arity LSB3 Max aver aging EZS Zero-scale error LSB3 VADIN = VSSA K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 40 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 24. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol EFS Description Full-scale error Conditions1 * 16 bit differential * 16 bit single-ended * 13 bit differential * 12 bit single-ended * 11 bit differential * 10 bit single-ended * 9 bit differential * 8 bit single-ended * 16 bit modes Min. -- -- -- -- -- -- -- -- -- -- Typ.2 0 to +10 0 to +14 1.0 TBD 0.4 0.4 0.2 0.2 Max. -- -- TBD TBD TBD TBD 0.5 0.5 -- Unit LSB3 Notes VADIN = VDDA EQ Quantization er ror ENOB Effective number 16 bit differential mode of bits * Avg=32 * Avg=16 * Avg=8 * Avg=4 * Avg=1 Pr el im in ar y -1 to 0 -- * 13 bit modes 0.5 TBD TBD TBD TBD TBD 13.6 14.1 13.2 TBD TBD TBD TBD TBD bits bits bits bits bits TBD TBD 16 bit single-ended mode * Avg=32 * Avg=16 * Avg=8 * Avg=4 * Avg=1 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD bits bits bits bits bits dB See ENOB 6.02 x ENOB + 1.76 16 bit differential mode * Avg=32 16 bit single-ended mode * Avg=32 -- TBD TBD dB -- -94 TBD dB TBD TBD 95 TBD -- -- dB dB 16 bit single-ended mode * Avg=32 Table continues on the next page... LSB3 4 SINAD THD Signal-to-noise plus distortion Total harmonic distortion 4 SFDR Spurious free dy 16 bit differential mode namic range * Avg=32 4 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 41 Peripheral operating requirements and behaviors Table 24. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol EIL Description Input leakage er ror Conditions1 Min. Typ.2 IIn x RAS Max. Unit mV Notes IIn = leak age cur rent (refer to the MCU's voltage and cur rent oper ating rat ings) VTEMP25 Temp sensor voltage 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. 1 LSB = (VREFH - VREFL)/2N 4. Input data is 1 kHz sine wave. 6.6.1.3 Symbol VDDA VREFPGA VADIN RPGA 16-bit ADC with PGA operating conditions Description Conditions Min. Typ.1 -- Pr el im in ar y * 25C to 105C -- -- TBD TBD -- -- 25C mV Temp sensor slope * -40C to 25C -- TBD -- mV/C mV/C Table 25. 16-bit ADC with PGA operating conditions Max. 3.6 Absolute 1.71 Unit V V V Notes Supply voltage PGA ref voltage Input voltage VREFOUT VREFOUT VREFOUT VSSA TBD TBD TBD TBD TBD TBD -- 1.25 -- VDDA TBD TBD TBD TBD TBD TBD -- -- 2, 3 Input impedance Gain = 1, 2, 4, 8 Gain = 16, 32 Gain = 64 64 32 16 k RPGAD Differntial input impedance Gain = 1, 2, 4, 8 Gain = 16, 32 Gain = 64 128 64 32 100 -- k IN+ to IN- RAS TS Analog source resistance ADC sampling time Gain = 16, 32 Gain = 64 s 4 5 1. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 6 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. ADC must be configured to use the internal voltage reference (VREFOUT) 3. PGA reference connected to the VREFOUT pin. If the user wishes to drive VREFOUT with a voltage other than the output of the VREF module, the VREF module must be disabled. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 42 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 4. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop in PGA gain without affecting other performances. This is not dependent on ADC clock frequency. 5. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25s time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at 8 MHz ADC clock. The ADLSTS bits can be adjusted for different ADC clock frequency 6.6.1.4 Symbol IDDA_PGA ILKG G 16-bit ADC with PGA characteristics Table 26. 16-bit ADC with PGA characteristics Description Supply current Leakage current Gain2 PGA disabled Conditions Min. TBD -- Typ.1 590 <1 1 2 Max. TBD TBD TBD TBD TBD TBD TBD TBD TBD 0.5 4 Unit A A dB dB dB dB dB dB dB dB Notes Pr el im in ar y * PGAG=0 * PGAG=1 * PGAG=2 * PGAG=3 * PGAG=4 * PGAG=5 * PGAG=6 TBD TBD TBD TBD TBD TBD TBD -- -- -- 3.9 TBD TBD 29.9 TBD -- -- -- * 16-bit modes * < 16-bit modes kHz kHz dB 40 -- Gain=1 TBD TBD * Gain=1 TBD TBD TBD TBD -- -- dB dB * Gain=64 -- -- * Gain=1 * Gain=64 Gain=1 * Gain=1 * Gain=64 -- -- -- -- -- 0.2 TBD 10 TBD TBD TBD TBD TBD mV s ppm/C ppm/C ppm/C %/V %/V TBD TBD TBD TBD TBD TBD Table continues on the next page... RAS < 100 GA BW Gain error RAS < 100 Input signal band width Power supply re jection ration PSRR VDDA= 3V 100mV, fVDDA= 50Hz, 60Hz VCM= 500mVpp, fVCM= 50Hz, 100Hz Gain=1, ADC Averaging=32 3 0 to 50C CMRR Common mode rejection ratio VOFS TGSW dG/dT Input offset volt age Gain switching settling time Gain drift over temperature Offset drift over temperature Gain drift over supply voltage dVOFS/dT dG/dVDDA 0 to 50C, ADC Averaging=32 VDDA from 1.71 to 3.6V K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 43 Peripheral operating requirements and behaviors Table 26. 16-bit ADC with PGA characteristics (continued) Symbol EIL Description Input leakage er ror Conditions All modes Min. Typ.1 IIn x RAS Max. Unit mV Notes IIn = leakage current (refer to the MCU's voltage and current op erating ratings) VPP,DIFF Maximum differ ential input signal swing Signal-to-noise ratio Total harmonic distortion * Gain=1 * Gain=64 * Gain=1 * Gain=64 * Gain=1 * Gain=64 [(VREFPGA x 2.33) - 0.2] / (2 x Gain) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 8.3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- V 4 THD Pr el im in ar y 57.7 87.3 85.3 dB dB dB dB dB 92.42 92.54 12.3 12.7 8.4 8.7 * Gain=1, Average=4 * Gain=1, Average=8 bits bits bits bits bits bits bits bits bits bits bits dB * Gain=64, Average=4 * Gain=64, Average=8 * Gain=1, Average=32 * Gain=2, Average=32 * Gain=4, Average=32 * Gain=8, Average=32 13.4 13.1 12.6 11.8 11.1 10.2 9.3 * Gain=16, Average=32 * Gain=32, Average=32 * Gain=64, Average=32 See ENOB 6.02 x ENOB + 1.76 SNR dB Average=32 Average=32, fin=100Hz Average=32, fin=100Hz SFDR Spurious free dy namic range Effective number of bits ENOB SINAD Signal-to-noise plus distortion ra tio 1. Typical values assume VDDA =3.0V, Temp=25C, fADCK=6MHz unless otherwise stated. 2. Gain = 2PGAGx 3. When the PGA gain is changed, it takes some time to settle the output for the ADC to work properly. During a gain switching, a few ADC outputs should be discarded (minimum two data samples, may be more depending on ADC sampling rate and time of the switching). 4. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the PGA reference voltage and gain setting. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 44 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.6.2 CMP and 6-bit DAC electrical specifications Table 27. Comparator and 6-bit DAC electrical specifications Symbol VDD IDDHS IDDLS IDDOFF VAIN VAIO VH Description Supply voltage Supply current, High-speed mode (EN=1, PMODE=1, VDDA >= VLVI_trip) Supply current, low-speed mode (EN=1, PMODE=0) Supply current, OFF Mode (EN=0,) Analog input voltage Analog input offset voltage Min. 1.71 -- -- -- VSS - 0.3 -- Typ. -- -- -- -- -- -- Max. 3.6 200 20 100 VDD 20 Unit V A A nA V mV Analog comparator hysteresis * HYSTCTR = 00 * HYSTCTR = 01 * HYSTCTR = 10 * HYSTCTR = 11 Pr el im in ar y -- -- -- -- 5 -- -- -- -- -- 10 20 30 -- -- VDD - 0.5 -- 0.5 20 50 120 420 120 -- -- 250 -- -- -- -- TBD 8 -0.5 -0.3 0.5 0.3 mV mV mV mV V V ns ns ns A LSB1 LSB VCMPOh VCMPOl tDHS tDLS Output high Output low Propagation delay, high-speed mode (EN=1, PMODE=1) Propagation delay, low-speed mode (EN=1, PMODE=1) Analog comparator initialization delay IDAC6b INL DNL 6-bit DAC current adder (enabled) 6-bit DAC integral non-Llnearity 6-bit DAC differential non-linearity 1. 1 LSB = Vreference/64 6.6.3 12-bit DAC electrical characteristics 6.6.3.1 Symbol VDDA VDACR TA 12-bit DAC operating requirements Desciption Supply voltage Reference voltage Temperature Table 28. 12-bit DAC operating requirements Min. 1.71 1.15 -40 Table continues on the next page... Max. 3.6 3.6 105 Unit V V C 1 Notes K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 45 Peripheral operating requirements and behaviors Table 28. 12-bit DAC operating requirements (continued) Symbol CL IL Desciption Output load capacitance Output load current Min. -- -- Max. 100 1 Unit pF mA Notes 2 1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREFO) 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC 6.6.3.2 Symbol n 12-bit DAC operating behaviors Description Resolution Table 29. 12-bit DAC operating behaviors Min. 12 -- -- -- -- -- 1 0 Typ. -- -- -- Max. 12 Unit b Notes IDDA_DACLP Supply current -- low-power mode IDDA_DACH Supply current -- high-speed mode P tDACLP tDACHP tCCDACLP tCCDACHP Vdacoutl Vdacouth INL DNL DNL VOFFSET EG PSRR TCO TGE AC Rop Full-scale settling time (0x080 to 0xF7F) -- lowpower mode Pr el im in ar y 150 700 200 30 5 A A s s s s 100 15 -- TBD 100 -- -- -- -- -- -- -- -- mV mV VDACR -100 3 VDACR 8 1 1 LSB LSB LSB 0.5 0.5 0.4 0.1 60 -- -- -- -- Table continues on the next page... TBD TBD -- -- 0.8 0.6 90 -- -- TBD 250 %FSR %FSR dB V/C ppm of FSR/C V/yr 1 1 1 1 Full-scale settling time (0x080 to 0xF7F) -- highpower mode Code-to-code settling time (0xBF8 to 0xC08) -- low-power mode Code-to-code settling time (0xBF8 to 0xC08) -- high-speed mode DAC output voltage range low -- high-speed mode, no load, DAC set to 0x000 DAC output voltage range high -- high-speed mode, no load, DAC set to 0xFFF Integral non-linearity error -- high speed mode Differential non-linearity error -- VDACR > 2 V 2 3 4 5 5 Differential non-linearity error -- VDACR = VRE FO (1.15 V) Offset error Gain error Power supply rejection ratio, VDDA > = 2.4 V Temperature coefficient offset voltage Temperature coefficient gain error Offset aging coefficient Output resistance load = 3 k K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 46 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 29. 12-bit DAC operating behaviors (continued) Symbol SR Description Slew rate -80h F7Fh 80h * High power (SPHP) * Low power (SPLP) CT BW Channel to channel cross talk 3dB bandwidth * High power (SPHP) * Low power (SPLP) 1. 2. 3. 4. 5. 550 40 -- -- -- -- 1.2 0.05 -- 1.7 0.12 -- -- -- -80 dB kHz Min. Typ. Max. Unit V/s Notes Settling within 1 LSB The INL is measured for 0+100mV to VDACR-100 mV The DNL is measured for 0+100 mV to VDACR-100 mV The DNL is measured for 0+100mV to VDACR-100 mV with VDDA > 2.4V Calculated by a best fit curve from VSS+100 mV to VREF-100 mV Freescale Semiconductor, Inc. Pr el im in ar y Figure 14. Typical INL error vs. digital code K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 47 Peripheral operating requirements and behaviors 6.6.4 Voltage Reference Electrical Specifications Symbol VDDA TA CL Description Pr el im in ar y Figure 15. Offset at half scale vs. temperature Table 30. VREF full-range operating requirements Min. Max. 3.6 105 100 1.71 -40 -- Unit V C nF Notes Supply voltage Temperature Output load capacitance Table 31. VREF full-range operating behaviors Symbol Vout Vout Vdrift Description Voltage reference output with factory trim Voltage reference output without factory trim Temperature drift (Vmax -Vmin across the full temperature range) Min. TBD 1.15 -- Typ. 1.2 -- -- Max. TBD 1.24 7 Unit V V mV See Fig ure 16 Notes Table continues on the next page... K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 48 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 31. VREF full-range operating behaviors (continued) Symbol Tc Ac Ioff Ibg Itr Description Temperature coefficient Aging coefficient Powered down current (off mode, VREFEN = 0, VRSTEN = 0) Bandgap only (MODE_LV = 00) current Tight-regulation buffer (MODE_LV =10) current Load regulation (MODE_LV = 10) current Tstup DC Buffer startup time Min. -- -- -- -- -- -- 100 -- Typ. -- -- -- TBD -- -- -- -- -- Max. TBD TBD 0.10 75 1.1 100 TBD TBD TBD Unit ppm/C ppm/year A A mA V/mA s Notes Line regulation (power supply rejection) Symbol TA Description Pr el im in ar y mV dB -60 Table 32. VREF limited-range operating requirements Min. 0 Max. 50 Unit C Notes Temperature Table 33. VREF limited-range operating behaviors Min. Max. TBD TBD Symbol Vout Description Unit A Notes Voltage reference output with factory trim TBD Figure 16. Typical output vs.temperature TBD Figure 17. Typical output vs. VDD 6.7 Timers See General Switching Specifications. 6.8 Communication interfaces K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 49 Peripheral operating requirements and behaviors 6.8.1 Ethernet Switching Specifications The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive at timing specs/constraints for the physical interface. 6.8.1.1 MII Signal Switching Specifications The following timing specs meet the requirements for MII style interfaces for a range of transceiver devices. Symbol -- MII1 Description Pr el im in ar y Table 34. Ethernet MII mode signal timing Min. -- Max. 25 35% 65% 35% 65% 5 5 -- -- -- 25 35% 65% 35% 65% 2 -- -- 25 MII6 MII5 Unit MHz RXCLK period RXCLK period ns ns MHz TXCLK period TXCLK period ns ns RXCLK frequency RXCLK pulse width high MII2 RXCLK pulse width low MII3 MII4 -- MII5 RXD[3:0], RXDV, RXER to RXCLK setup RXCLK to RXD[3:0], RXDV, RXER hold TXCLK frequency TXCLK pulse width high MII6 TXCLK pulse width low MII7 MII8 TXCLK to TXD[3:0], TXEN, TXER invalid TXCLK to TXD[3:0], TXEN, TXER valid TXCLK (input) MII8 MII7 Valid data TXD[n:0] TXEN Valid data TXER Valid data Figure 18. MII transmit signal timing diagram K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 50 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors MII2 MII1 RXCLK (input) MII3 MII4 RXD[n:0] Valid data RXDV Valid data RXER Valid data 6.8.1.2 RMII signal switching specifications The following timing specs meet the requirements for RMII style interfaces for a range of transceiver devices. Table 35. Ethernet RMII mode signal timing Min. -- Num -- RMII1 RMII2 RMII3 RMII4 RMII7 RMII8 Description Max. 50 Unit MHz RMII_CLK period RMII_CLK period ns ns ns ns EXTAL frequency (RMII input clock RMII_CLK) RMII_CLK pulse width high RMII_CLK pulse width low RXD[1:0], CRS_DV, RXER to RMII_CLK setup RMII_CLK to RXD[1:0], CRS_DV, RXER hold RMII_CLK to TXD[1:0], TXEN invalid RMII_CLK to TXD[1:0], TXEN valid 6.8.2 USB electrical specifications The USB electricals for the USB On-the-Go module conform to the standards documented by the Universal Serial Bus Implementers Forum. For the most up-to-date standards, visit http://www.usb.org. Freescale Semiconductor, Inc. Pr el im in ar y Figure 19. MII receive signal timing diagram 35% 35% 4 2 4 65% 65% -- -- -- -- 15 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 51 Peripheral operating requirements and behaviors 6.8.3 USB DCD Electrical Specifications Table 36. USB DCD specifications Symbol VDP_SRC VLGC IDP_SRC IDM_SINK RDM_DWN VDAT_REF Description USB_DP source voltage (up to 250 A) Threshold voltage for logic high USB_DP source current USB_DM sink current D- pulldown resistance for data pin contact detect Data detect voltage Min. TBD 0.8 7 50 14.25 0.25 Typ. TBD -- 10 100 -- TBD Max. TBD 2.0 13 150 24.8 0.4 Unit V V A A k V 6.8.4 USB Voltage Regulator Electrical Specifications Symbol VREGIN IDDon IDDstby IDDoff ILOADrun ILOADstby VReg33out Description Min. 2.7 -- -- -- -- -- Typ. -- Pr el im in ar y Table 37. USB voltage regulator electrical specifications Max. 5.5 -- -- Unit V 120 A A nA TBD -- -- -- 500 120 mA mA TBD 3 3.3 -- 2.2 -- 290 3.6 3.6 8.16 100 395 V V V F m mA TBD 2.3 1.76 1 185 TBD TBD Notes Input supply voltage Quiescent current -- Run mode, load current equal zero Quiescent current -- Standby mode, load cur rent equal zero Quiescent current -- Shutdown mode Maximum load current -- Run mode Maximum load current -- Standby mode Regulator output voltage -- Input supply (VRE GIN) > 3.6 V * Run mode * Standby mode 1 * Pass-through mode COUT ESR ILIM External output capacitor External output capacitor equivalent series re sistance Current limitation threshold 1. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad. K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 52 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.5 DSPI Switching Specifications for Low-speed Operation The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provides DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 38. Master Mode DSPI Timing (Low-speed mode) Num Operating voltage Frequency of operation DS1 DS2 DS3 DS4 DS5 DS6 DS7 DS8 Description Min. 1.71 -- Max. 3.6 12.5 -- Unit V MHz ns ns ns ns ns ns ns ns Notes 1 DSPI_SCK output cycle time DSPI_SCK output high/low time DSPI_PCSn to DSPI_SCK output valid DSPI_SCK to DSPI_PCSn output hold DSPI_SCK to DSPI_SOUT valid DSPI_SCK to DSPI_SOUT invalid DSPI_SIN to DSPI_SCK input setup DSPI_SCK to DSPI_SIN input hold 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. DSPI_PCSn DSPI_SCK (CPOL=0) DSPI_SIN DSPI_SOUT Num Operating voltage Frequency of operation DS9 Pr el im in ar y 4 x tBCLK (tSCK/2) - 4 (tSCK/2) - 4 (tSCK/2) - 4 -- -2 (tSCK/2) + 4 -- -- 10 -- -- -- 15 0 DS3 DS2 DS1 DS4 DS7 DS8 First data Data Last data DS5 DS6 First data Data Last data Figure 20. DSPI Classic SPI Timing -- Master Mode Table 39. Slave Mode DSPI Timing (Low-speed Mode) Description Min. 1.71 -- 8 x tBCLK Table continues on the next page... Max. 3.6 6.25 -- Unit V MHz ns DSPI_SCK input cycle time K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 53 Peripheral operating requirements and behaviors Table 39. Slave Mode DSPI Timing (Low-speed Mode) (continued) Num DS10 DS11 DS12 DS13 DS14 DS15 DS16 Description DSPI_SCK input high/low time DSPI_SCK to DSPI_SOUT valid DSPI_SCK to DSPI_SOUT invalid DSPI_SIN to DSPI_SCK input setup DSPI_SCK to DSIP_SIN input hold DSPI_SS active to DSPI_SOUT driven DSPI_SS inactive to DSPI_SOUT not driven Min. (tSCK/2) - 4 -- 0 5 15 -- -- Max. (tSCK/2) + 4 20 -- -- -- 15 15 Unit ns ns ns ns ns ns ns DSPI_SS DSPI_SCK (CPOL=0) DSPI_SOUT DSPI_SIN 6.8.6 DSPI Switching Specifications (High-speed mode) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 40. Master Mode DSPI Timing (High-speed mode) Num Operating voltage Frequency of operation DS1 DS2 DS3 DSPI_SCK output cycle time DSPI_SCK output high/low time DSPI_PCSn to DSPI_SCK output valid Table continues on the next page... Description Min. 2.7 -- 2 x tBCLK (tSCK/2) - 2 (tSCK/2) - 2 Max. 3.6 25 -- (tSCK/2) + 2 -- Unit V MHz ns ns ns 54 Pr el im in ar y DS10 DS9 DS15 DS12 DS11 DS16 First data Data Last data DS13 DS14 First data Data Last data Figure 21. DSPI Classic SPI Timing -- Slave Mode K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 40. Master Mode DSPI Timing (High-speed mode) (continued) Num DS4 DS5 DS6 DS7 DS8 Description DSPI_SCK to DSPI_PCSn output hold DSPI_SCK to DSPI_SOUT valid DSPI_SCK to DSPI_SOUT invalid DSPI_SIN to DSPI_SCK input setup DSPI_SCK to DSPI_SIN input hold Min. (tSCK/2) - 2 -- -2 TBD 0 Max. -- 8.5 -- -- -- Unit ns ns ns ns ns DSPI_PCSn DSPI_SCK (CPOL=0) DSPI_SIN DSPI_SOUT Num Pr el im in ar y DS3 DS2 DS1 DS4 DS7 DS8 First data Data Last data DS5 DS6 First data Data Last data Figure 22. DSPI Classic SPI Timing -- Master Mode Table 41. Slave Mode DSPI Timing (High-speed mode) Description Min. 2.7 Max. 3.6 Unit V MHz ns ns ns ns ns ns ns ns Operating voltage Frequency of operation DS9 DS10 DS11 DS12 DS13 DS14 DS15 DS16 12.5 -- DSPI_SCK input cycle time 4 x tBCLK DSPI_SCK input high/low time (tSCK/2) - 2 -- 0 2 7 -- -- (tSCK/2 + 2 TBD -- -- -- 14 14 DSPI_SCK to DSPI_SOUT valid DSPI_SCK to DSPI_SOUT invalid DSPI_SIN to DSPI_SCK input setup DSPI_SCK to DSIP_SIN input hold DSPI_SS active to DSPI_SOUT driven DSPI_SS inactive to DSPI_SOUT not driven K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 55 Peripheral operating requirements and behaviors DSPI_SS DS10 DS9 DSPI_SCK (CPOL=0) DSPI_SOUT DS13 DS15 DS12 First data DS14 First data Data Last data DS11 Data Last data DS16 DSPI_SIN 6.8.7 SDHC Specifications The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive at timing specs/constraints for the physical interface. Table 42. SDHC switching specifications Min. Card input clock Num Symbol Description Max. Unit SD1 fpp fpp fpp Pr el im in ar y Figure 23. DSPI Classic SPI Timing -- Slave Mode Clock frequency (low speed) 0 0 0 0 7 7 400 25 20 Clock frequency (SD\SDIO full speed) Clock frequency (MMC full speed) Clock frequency (identification mode) Clock low time 400 -- -- 3 3 Clock high time Clock rise time Clock fall time -- -- SDHC output delay (output valid) -5 6.5 SDHC input / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SDHC input setup time SDHC input hold time 5 0 -- -- kHz MHz MHz kHz ns ns ns ns fOD SD2 SD3 SD4 SD5 tWL tWH tTLH tTHL SDHC output / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SD6 tOD ns SD7 SD8 tTHL tTHL ns ns K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 56 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SD3 SD2 SD1 SDHC_CLK SD6 Output SDHC_CMD Output SDHC_DAT[3:0] SD7 SD8 Input SDHC_CMD Input SDHC_DAT[3:0] 6.8.8 I2S Switching Specifications This section provides the AC timings for the I2S in master (clocks driven) and slave modes (clocks input). All timings are given for non-inverted serial clock polarity (TCR[TSCKP] = 0, RCR[RSCKP] = 0) and a non-inverted frame sync (TCR[TFSI] = 0, RCR[RFSI] = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal (I2S_BCLK) and/or the frame sync (I2S_FS) shown in the figures below. Table 43. I2S master mode timing Num Description Min. 2.7 Max. 3.6 Unit V ns MCLK period ns BCLK period ns ns ns ns ns ns Operating voltage S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 I2S_MCLK cycle time I2S_MCLK pulse width high/low I2S_BCLK cycle time I2S_BCLK pulse width high/low I2S_BCLK to I2S_FS output valid I2S_BCLK to I2S_FS output invalid I2S_BCLK to I2S_TXD valid I2S_BCLK to I2S_TXD invalid I2S_RXD/I2S_FS input setup before I2S_BCLK I2S_RXD/I2S_FS input hold after I2S_BCLK Freescale Semiconductor, Inc. Pr el im in ar y Figure 24. SDHC timing 2 x tSYS 45% 55% -- 55% 15 -- 15 -- -- -- 5 x tSYS 45% -- -2.5 -- -3 20 0 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 57 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_BCLK (output) S4 S5 S4 S6 I2S_FS (output) S9 S10 I2S_FS (input) S7 S8 S7 S8 I2S_TXD I2S_RXD Num Description Pr el im in ar y S9 S10 Figure 25. I2S timing -- master mode Table 44. I2S alave mode timing Min. 2.7 Max. 3.6 -- Unit V ns MCLK period ns ns ns ns ns ns Operating voltage S11 S12 S13 S14 S15 S16 S17 S18 I2S_BCLK cycle time (input) 8 x tSYS 45% 10 3 I2S_BCLK pulse width high/low (input) I2S_FS input setup before I2S_BCLK I2S_FS input hold after I2S_BCLK 55% -- -- I2S_BCLK to I2S_TXD/I2S_FS output valid -- 0 20 -- -- -- I2S_BCLK to I2S_TXD/I2S_FS output invalid I2S_RXD setup before I2S_BCLK I2S_RXD hold after I2S_BCLK 10 2 S11 S12 I2S_BCLK (input) S15 S12 S16 I2S_FS (output) S13 S14 I2S_FS (input) S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 26. I2S timing -- slave modes K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 58 Preliminary Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.9 Human-machine interfaces (HMI) 6.9.1 General Switching Specifications These general purpose specifications apply to all signals configured for GPIO, SCI, FlexCAN, CMT, IEEE 1588 timer, and I2C signals. Table 45. General switching specifications Symbol Description Pr el im in ar y Min. 1.5 Max. -- -- -- -- -- Unit 100 16 ns ns TBD 2 -- -- 12 36 ns ns -- -- 32 36 ns ns Notes 1 2 2 GPIO pin interrupt pulse width (digital glitch filter disa bled) -- Synchronous path GPIO pin interrupt pulse width (digital glitch filter disa bled, analog filter enabled) -- Asynchronous path GPIO pin interrupt pulse width (digital glitch filter disa bled, analog filter disabled) -- Asynchronous path External reset pulse width (digital glitch filter disabled) Mode select (EZP_CS) hold time after reset deasser tion Port rise and fall time (high drive strength) * Slew disabled * Slew enabled Bus clock cycles Bus clock cycles 3 Port rise and fall time (low drive strength) * Slew disabled * Slew enabled 1. 2. 3. 4. 4 The greater synchronous and asynchronous timing must be met. This is the shortest pulse that is guaranteed to be recognized. 75pF load 15pF load 6.9.2 TSI Electrical Specifications Table 46. Touch Sensing Input module specifications Symbol VDDTSI CELE fREFmax Description Operating voltage Target electrode capacitance range Reference oscillator frequency Min. 1.71 1 -- Typ. -- 20 5.5 Max. 3.6 500 TBD Unit V pF MHz 1 Notes Table continues on the next page... K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Freescale Semiconductor, Inc. Preliminary 59 Dimensions Table 46. Touch Sensing Input module specifications (continued) Symbol fELEmax CREF VDELTA IREF IELE Pres5 Pres20 Pres100 Max Sens20 MaxSens Res TCon20 ITSI_RUN ITSI_LP Description Electrode oscillator frequency Internal reference capacitor Oscillator delta voltage Reference oscillator current source base current Electrode oscillator current source base current Electrode capacitance measurement precision Electrode capacitance measurement precision Electrode capacitance measurement precision Max sensitivity @ 20pF electrode Maximum sensitivity Resolution Min. -- TBD TBD TBD TBD -- -- -- Typ. 0.5 1 600 1 1 TBD TBD TBD Max. TBD TBD TBD TBD TBD TBD TBD TBD 600 24 16 -- -- Unit MHz pF mV A A % % % 2 3 4 5 6 7 8 Notes Response time @ 20pF Pr el im in ar y 0.15 0.326 0.326 -- fF fF 0.006 -- -- -- -- bits s 30 TBD 1 A A TBD 98ASS23308W 98ARH98267A 9 Current added in run mode Low power mode current adder 1. The TSI module is functional with capacitance values outside of this range. However, optimal performance is not guaranteed. 2. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current 3. The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current 4. Measured with a 5pF electrode, reference oscillator frequency of 10MHz, PS = 128, NCSC = 8; Iext = 16 5. Measured with a 20pF electrode, reference oscillator frequency of 10MHz, PS = 128, NCSC = 2; Iext = 16 6. Measured with a 20pF electrode, reference oscillator frequency of 10MHz, PS = 16, NCSC = 3; Iext = 16 7. 6.2ms scan time 8. 1pF electrode capacitance with 4.96ms scan time 9. Time that takes to do one complete measurement of the electrode. Sensitivity resolution of 0.0133pF 7 Dimensions 7.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to www.freescale.com and perform a keyword search for the drawing's document number: If you want the drawing for this package 100-pin LQFP 104-pin MAPBGA Then use this document number K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 60 Preliminary Freescale Semiconductor, Inc. Pinout 8 Pinout 8.1 K60 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 ADC1_SE4a ADC1_SE5a ADC1_SE6a ADC1_SE7a DISABLED DISABLED DISABLED VDD VSS USB0_DP USB0_DM VOUT33 VREGIN ADC0_DP1 ADC0_DM1 ADC1_DP1 ADC1_DM1 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 VDDA VREFH ADC1_SE4a ADC1_SE5a ADC1_SE6a ADC1_SE7a VDD VSS USB0_DP VOUT33 VREGIN USB0_DM ADC0_DP1 ADC1_DP1 ADC0_DM1 ADC1_DM1 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 VDDA VREFH 19 20 21 22 23 Freescale Semiconductor, Inc. Pr el im in ar y PTE0 SPI1_PCS1 SPI1_SCK SPI1_SIN UART1_TX SDHC0_D1 I2C1_SDA I2C1_SCL PTE1 SPI1_SOUT UART1_RX SDHC0_D0 PTE2 UART1_CTS_ SDHC0_DCLK b UART1_RTS_ SDHC0_CMD b UART3_TX SDHC0_D3 UART3_RX SDHC0_D2 PTE3 PTE4 SPI1_PCS0 PTE5 SPI1_PCS2 PTE6 SPI1_PCS3 UART3_CTS_ I2S0_MCLK b I2S0_CLKIN 100 QFP Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 61 Pinout 100 QFP 24 25 26 27 28 29 30 31 32 33 34 Default VREFL VSSA VREF_OUT DAC0_OUT XTAL32 EXTAL32 VBAT ADC0_SE17 ADC0_SE18 DISABLED JTAG_TCLK/ SWD_CLK/ EZP_CLK JTAG_TDI/ EZP_DI ALT0 VREFL VSSA VREF_OUT DAC0_OUT XTAL32 EXTAL32 VBAT ADC0_SE17 ADC0_SE18 PTE24 PTE25 PTE26 CAN1_TX CAN1_RX UART4_TX UART4_RX UART4_CTS_ ENET_1588_ b CLKIN EWM_OUT_b EWM_IN RTC_CLKOUT USB_CLKIN JTAG_TCLK/ SWD_CLK JTAG_TDI EZP_CLK ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort TSI0_CH1 35 36 TSI0_CH2 Pr el im in ar y PTA0 UART0_CTS_ FTM0_CH5 b UART0_RX UART0_TX FTM0_CH6 PTA1 PTA2 FTM0_CH7 PTA3 UART0_RTS_ FTM0_CH0 b PTA4 FTM0_CH1 NMI_b PTA5 FTM0_CH2 RMII0_RXER/ CMP2_OUT MII0_RXER PTA12 CAN0_TX FTM1_CH0 RMII0_RXD1/ MII0_RXD1 I2S0_TXD PTA13 CAN0_RX FTM1_CH1 UART0_TX RMII0_RXD0/ MII0_RXD0 I2S0_TX_FS PTA14 SPI0_PCS0 SPI0_SCK SPI0_SOUT SPI0_SIN RMII0_CRS_D V/MII0_RXDV RMII0_TXEN/ MII0_TXEN I2S0_TX_BCL K I2S0_RXD I2S0_RX_FS I2S0_MCLK PTA15 PTA16 UART0_RX UART0_CTS_ RMII0_TXD0/ b MII0_TXD0 UART0_RTS_ RMII0_TXD1/ b MII0_TXD1 PTA17 PTA18 PTA19 FTM0_FLT2 FTM1_FLT0 FTM_CLKIN0 FTM_CLKIN1 LPT0_ALT1 EZP_DI JTAG_TDO/ TSI0_CH3 TRACE_SWO/ EZP_DO JTAG_TMS/ SWD_DIO NMI_b/ EZP_CS_b JTAG_TRST VDD VSS CMP2_IN0 CMP2_IN1 DISABLED DISABLED DISABLED ADC1_SE17 VDD VSS EXTAL XTAL RESET_b VDD VSS JTAG_TDO/ EZP_DO TRACE_SWO JTAG_TMS/ SWD_DIO EZP_CS_b 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 TSI0_CH4 TSI0_CH5 I2S0_RX_BCL JTAG_TRST K CMP2_IN0 FTM1_QD_PH A FTM1_QD_PH B CMP2_IN1 ADC1_SE17 VDD VSS EXTAL XTAL RESET_b I2S0_CLKIN K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. 62 Preliminary Freescale Semiconductor, Inc. Pinout 100 QFP 53 Default ADC0_SE8/ ADC1_SE8/ TSI0_CH0 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 ADC0_SE12/ TSI0_CH7 ADC0_SE13/ TSI0_CH8 DISABLED ADC1_SE14 ADC1_SE15 VSS VDD TSI0_CH9 TSI0_CH10 TSI0_CH11 TSI0_CH12 DISABLED DISABLED DISABLED DISABLED ADC0_SE14/ TSI0_CH13 ADC0_SE15/ TSI0_CH14 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 CMP1_IN1 VSS VDD DISABLED DISABLED CMP0_IN0 CMP0_IN1 ADC1_SE4b/ CMP0_IN2 ADC1_SE5b/ CMP0_IN3 ADC1_SE6b/ CMP0_IN4 CMP0_IN0 CMP0_IN1 ADC1_SE4b/ CMP0_IN2 ADC1_SE5b/ CMP0_IN3 ADC1_SE6b/ CMP0_IN4 ALT0 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 ADC0_SE12/ TSI0_CH7 ADC0_SE13/ TSI0_CH8 ALT1 PTB0 ALT2 I2C0_SCL ALT3 FTM1_CH0 ALT4 RMII0_MDIO/ MII0_MDIO RMII0_MDC/ MII0_MDC ALT5 ALT6 FTM1_QD_PH A FTM1_QD_PH B FTM0_FLT3 FTM0_FLT0 FB_AD20 ALT7 EzPort 54 PTB1 I2C0_SDA FTM1_CH1 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 PTB2 PTB3 PTB9 I2C0_SCL I2C0_SDA SPI1_PCS1 UART0_RTS_ ENET0_1588_ b TMR0 UART0_CTS_ ENET0_1588_ b TMR1 UART3_CTS_ b ADC1_SE14 VSS VDD ADC1_SE15 TSI0_CH9 TSI0_CH10 TSI0_CH11 TSI0_CH12 ADC0_SE14/ TSI0_CH13 ADC0_SE15/ TSI0_CH14 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 CMP1_IN1 VSS VDD 73 74 75 76 77 78 79 80 81 82 Freescale Semiconductor, Inc. Pr el im in ar y PTB10 SPI1_PCS0 SPI1_SCK UART3_RX UART3_TX FB_AD19 FTM0_FLT1 PTB11 FB_AD18 FTM0_FLT2 PTB16 SPI1_SOUT SPI1_SIN CAN0_TX UART0_RX UART0_TX FTM2_CH0 FB_AD17 EWM_IN PTB17 FB_AD16 EWM_OUT_b PTB18 I2S0_TX_BCL FB_AD15 K I2S0_TX_FS FTM2_QD_PH A PTB19 CAN0_RX FTM2_CH1 FB_OE_b FB_AD31 FTM2_QD_PH B CMP0_OUT CMP1_OUT PTB20 SPI2_PCS0 SPI2_SCK SPI2_SIN PTB21 FB_AD30 PTB22 PTC0 SPI2_SOUT SPI0_PCS4 FB_AD29 CMP2_OUT PTB23 SPI0_PCS5 FB_AD28 PDB0_EXTRG I2S0_TXD FB_AD14 PTC1 SPI0_PCS3 UART1_RTS_ FTM0_CH0 b FB_AD13 PTC2 SPI0_PCS2 UART1_CTS_ FTM0_CH1 b UART1_RX FTM0_CH2 FB_AD12 PTC3 SPI0_PCS1 FB_CLKOUT PTC4 PTC5 PTC6 PTC7 PTC8 PTC9 PTC10 I2C1_SCL SPI0_PCS0 SPI0_SCK SPI0_SOUT SPI0_SIN I2S0_MCLK I2S0_CLKIN PDB0_EXTRG UART1_TX FTM0_CH3 LPT0_ALT2 FB_AD11 FB_AD10 FB_AD9 FB_AD8 FB_AD7 FTM2_FLT0 CMP1_OUT CMP0_OUT I2S0_RX_BCL FB_AD6 K I2S0_RX_FS FB_AD5 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 63 Pinout 100 QFP 83 84 85 86 87 88 89 90 Default ADC1_SE7b DISABLED DISABLED DISABLED DISABLED VSS VDD DISABLED VSS VDD PTC16 CAN1_RX UART3_RX ENET0_1588_ FB_CS5_b/ TMR0 FB_TSIZ1/ FB_BE23_16_ BLS15_8_b ALT0 ADC1_SE7b ALT1 PTC11 PTC12 PTC13 PTC14 PTC15 ALT2 I2C1_SDA UART4_RTS_ b UART4_CTS_ b UART4_RX UART4_TX ALT3 ALT4 I2S0_RXD ALT5 FB_RW_b FB_AD27 FB_AD26 FB_AD25 FB_AD24 ALT6 ALT7 EzPort 91 DISABLED 92 DISABLED 93 DISABLED 94 95 96 97 98 99 ADC0_SE5b DISABLED DISABLED DISABLED ADC0_SE6b ADC0_SE7b ADC0_SE5b ADC0_SE6b ADC0_SE7b 100 DISABLED 8.2 K60 Pinouts The below figure shows the pinout diagram for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, see the previous section. 64 Pr el im in ar y PTC17 CAN1_TX UART3_TX ENET0_1588_ FB_CS4_b/ TMR1 FB_TSIZ0/ FB_BE31_24_ BLS7_0_b PTC18 UART3_RTS_ ENET0_1588_ FB_TBST_b/ b TMR2 FB_CS2_b/ FB_BE15_8_B LS23_16_b FB_ALE/ FB_CS1_b/ FB_TS_b FB_CS0_b FB_AD4 PTD0 SPI0_PCS0 UART2_RTS_ b PTD1 SPI0_SCK UART2_CTS_ b UART2_RX UART2_TX PTD2 SPI0_SOUT SPI0_SIN SPI0_PCS1 PTD3 FB_AD3 PTD4 UART0_RTS_ FTM0_CH4 b FB_AD2 EWM_IN PTD5 SPI0_PCS2 UART0_CTS_ FTM0_CH5 b UART0_RX UART0_TX FTM0_CH6 FTM0_CH7 FB_AD1 EWM_OUT_b PTD6 SPI0_PCS3 CMT_IRO FB_AD0 FTM0_FLT0 PTD7 FTM0_FLT1 K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. Revision History PTC18 PTC17 PTC16 PTC15 PTC14 PTC13 PTC12 PTC11 PTC10 PTC7 PTD5 PTD4 PTD3 PTD2 PTD1 PTD0 PTD7 PTD6 PTC8 PTC9 PTC6 79 78 PTC5 77 VDD VSS 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 100 81 80 76 PTC4 PTE0 PTE1 PTE2 PTE3 PTE4 PTE5 PTE6 VDD VSS USB0_DP USB0_DM VOUT33 VREGIN ADC0_DP1/OP0_DP0 ADC0_DM1/OP0_DM0 ADC1_DP1/OP1_DP0/OP1_DM1 ADC1_DM1/OP1_DM0 PGA0_DP/ADC0_DP0/ADC1_DP3 PGA0_DM/ADC0_DM0/ADC1_DM3 PGA1_DP/ADC1_DP0/ADC0_DP3 PGA1_DM/ADC1_DM0/ADC0_DM3 VDDA VREFH VREFL VSSA 1 2 3 4 5 6 75 74 73 72 71 70 VDD VSS PTC3 PTC2 PTC1 PTC0 9 Revision History The following table provides a revision history for this document. Freescale Semiconductor, Inc. Pr el im in ar y 7 69 8 68 9 67 10 66 11 65 12 64 63 13 14 62 15 61 PTB23 PTB22 PTB21 PTB20 PTB19 PTB18 PTB17 PTB16 VDD VSS 16 60 17 59 PTB11 18 58 PTB10 19 57 PTB9 20 56 PTB3 21 55 PTB2 22 54 53 PTB1 PTB0 23 24 52 RESET_b PTA19 41 42 43 44 45 46 47 48 26 27 28 29 40 49 30 31 32 33 34 35 36 37 38 VREF_OUT DAC0_OUT XTAL32 EXTAL32 VBAT PTE24 PTE25 PTE26 39 PTA12 PTA13 PTA14 PTA15 PTA16 PTA17 Figure 27. K60 100 LQFP Pinout Diagram K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary 65 PTA18 PTA0 PTA1 PTA2 PTA3 PTA4 PTA5 VSS VDD VDD VSS 50 25 51 Revision History Table 47. Revision History Rev. No. 1 Date 11/2010 Substantial Changes Initial public revision 66 Pr el im in ar y K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010. Preliminary Freescale Semiconductor, Inc. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Pr el im in ar y Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. ARM is the registered trademark of ARM Limited. ARM Cortex-M4 is the trademark of ARM Limited. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2010. All rights reserved. K60P104M100SF2 Rev. 1 11/2010 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. |
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